@INPROCEEDINGS{Meyer2015b,
  howpublished = {Conference Proceedings},
  author = {Tobias Meyer AND Andreas Unger AND Simon Althoff AND Walter Sextro
	AND Michael Brökelmann AND Matthias Hunstig AND Karsten Guth},
  title = {Modeling and Simulation of the ultrasonic wire bonding process},
  booktitle = {2015 17th Electronics Packaging Technology Conference},
  year = {2015},
  abstract = {Ultrasonic wire bonding is an indispensable process in the manufacturing
	of semiconductor components. It is used for interconnecting the silicon
	die to e.g. connectors in the housing or to other semiconductors
	in complex components. In high power applications, such as wind turbines,
	locomotives or electric vehicles, the thermal and mechanical limits
	of interconnects made from aluminum are nearing. The limits could
	be overcome using copper wire bonds, but their manufacturing poses
	challenges due to the harder material, which leads to increased wear
	of the bond tools and to less reliable production. To overcome these
	drawbacks, adaptation of process parameters at runtime is employed.
	However, the range of parameter values for which a stable process
	can be maintained is very small, making it necessary to compute suitable
	parameters beforehand. To this end, and to gain insights into the
	process itself, the ultrasonic bonding process is modeled. The full
	model is composed of several partial models, some of which were introduced
	before. This paper focuses on the modularization of the full model
	and on the interaction of partial models. All partial models are
	presented, their interaction is shown and the general outline of
	the simulation process is given.},
  doi = {10.1109/EPTC.2015.7412377}
}